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Wax application device Product List

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Wafer Wax Application Device "LTP-250"

Wafer Wax Application Device "LTP-250"

Improvement of work parallelism! It is possible to de-bubble air and other contaminants that were mixed in during wafer attachment.

The "LTP-250" is a product that allows for vacuum degassing during wax application. It enables the uniformity and thinning of the wax film. By applying the wax in a vacuum state, it is possible to degas bubbles contained in the wax and air that may have been trapped during the application of warped wafers. 【Effects of the application process】 ■ Improved parallelism of the workpiece ■ Enhanced flatness of the polished surface ■ Uniformity of the wax film thickness ■ Thinning of the film ■ Improvement of film distortion *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • others
  • Wax application device

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Wafer bonding device prevents uneven wax thickness!

Wafer bonding device prevents uneven wax thickness!

A bonding device for compound semiconductor wafers, etc. It is a dedicated device for wafer waxing that achieves high-quality grinding and polishing.

By optimizing the heating and cooling mechanisms and employing a high-rigidity machine design, we achieve a uniform temperature distribution and stable load distribution, preventing the occurrence of wax thickness variations that can negatively impact precision. 【Features】 ■ Pressure, temperature, and time conditions can be set according to the characteristics of the wafer ■ Damage to the device is minimized ■ Achieves uniform temperature distribution and stable load distribution ■ Prevents the occurrence of wax thickness variations that affect precision ■ Compatible with 12-inch wafers *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wax application device

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